SEMICONDUCTOR AI AI SOLUTION
SemiconductorAI
By combining AI with physics-based analysis,
we predict the lifetime and reliability of semiconductor packages.
At the design stage, we analyze key potential defects such as cracks, voids, and electromigration (EM) in advance,
and recommend optimal design and process conditions to reduce development time and cost.
Core AI Technologies
Physics-Based Prediction AI
AI learns complex physical phenomena such as heat, stress, and current density, and predicts them quickly and accurately.
Lifetime Prediction AI
Quantitatively predicts package lifetime based on MTTF.
Defect Prediction AI
Analyzes in advance the likelihood of defects such as cracks, voids, and electromigration (EM).
Optimization AI
AI automatically optimizes design variables and process conditions and recommends the optimal solution.
Main Functions
Design Variable Optimization
Optimizes major design variables such as via diameter, copper thickness, and layer thickness to improve reliability.
Real-Time Anomaly Detection
Detects abnormal signs in process data in real time to proactively respond to quality risks.
Reliability Prediction
Predicts lifetime and the likelihood of defects to reduce risk and improve product reliability.
Process Condition Recommendation
AI recommends optimal process conditions to improve both yield and quality.
AI-Based Semiconductor Reliability Prediction Process
1. Design Input
· Package Structure
· Material Properties
· Operating Conditions
· Material Properties
· Operating Conditions
2. AI Analysis and Prediction
· Thermal, Mechanical, and Electrical Analysis
· AI Model Prediction
· AI Model Prediction
3. Reliability Evaluation
· MTTF Prediction
· Crack, Void, and EM Prediction
· Risk Assessment
· Crack, Void, and EM Prediction
· Risk Assessment
4. Optimal Design Proposal
· Design Variable Optimization
· Structure, Material, and Improvement Proposal
· Structure, Material, and Improvement Proposal
5. Verification and Deployment
· Performance Verification
· Reliability Comparison Analysis
· Reliability Comparison Analysis
6. Production Application
· Application to Product Design
· Mass Production Data Feedback
· Mass Production Data Feedback
Application Areas
AI Semiconductors
High-performance AI chips such as GPUs and NPUs
Improvement of package reliability
Improvement of package reliability
HBM
HBM(High Bandwidth Memory)
Securing package thermal and mechanical reliability
Securing package thermal and mechanical reliability
Advanced Packaging
2.5D/3D packaging, Chiplets, etc.
Application of advanced packaging technologies
Application of advanced packaging technologies
Power Semiconductors
Power semiconductors such as SiC and GaN
Reliability and lifetime prediction
Reliability and lifetime prediction
Automotive Semiconductors
Verification of lifetime and reliability for automotive semiconductors